The record
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- Researchers at IIT Madras have designed and tested a new cooling configuration for compact electronic devices using a Flat Plate Pulsating Heat Pipe with an 'O-ring' design.
- According to the institute, this configuration delivers 16 per cent lower overall thermal resistance than traditional designs, with potential applications in laptops, phones, data centres, electric vehicles, and defence and avionics.
- The team also found that using aluminium instead of copper reduces weight and improves performance, with aluminium versions showing about 20 per cent lower thermal resistance.
- The research was led by Prof. Arvind Pattamatta and Pallab Sinha Mahapatra of IIT Madras's Department of Mechanical Engineering, along with collaborators from Sri Sivasubramaniya Nadar College of Engineering, Chennai, and IRDE, Dehradun.
What to watch next
- Whether the technology moves from lab testing to commercial adoption in consumer electronics and other industries
- Any further research or partnerships building on the aluminium-versus-copper findings
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Named India · Arvind Pattamatta · Chennai · Davis T Vempany · Dehradun · Flat Plate Pulsating Heat Pipe · Hemanth Dileep · Indian Institute of Technology Madras · Instruments Research & Development Establishment · Laxman Kumar Malla · Pallab Sinha Mahapatra · Sri Sivasubramaniya Nadar College of Engineering
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